Copper Clad Laminate
Product Definition:
SAM Composites India Pvt. Ltd. is specialized in manufacturing of high-grade copper cladding laminate, such as FR4 which Halogen-free, lead-free as well as high CTl and TG. Our FR4 Copper Clad Laminates are a fire rated Electrical Grade, dielectric fiberglass material created under high pressure with electro deposited HTE (high temperature elongated) Copper Laminated onto the FR4 substrate. It is commonly used for PCBs. The products are widely used in the fields of computer, communications facilities, medical equipment, household appliances, aerospace, automotive electronics, new energy, etc.
Our sales network covers all major domestic and overseas markets.
Our extensive experience in both manufacturing and R & D has enabled us to consistently deliver exceptional quality and innovative solutions to meet the diverse needs of our clients. FR-4 Copper Clad Laminate is a versatile and high-performance material known for its exceptional electrical, mechanical, and thermal properties. We specialize in producing a wide range of grades, offering options (Halogen- free, lead-free, high CTl, high TG (glass transition temperature).
Additionally, our product portfolio includes FR-4 Copper Clad Laminates with a Comparative Tracking Index (CTI) of 1600, demonstrating superior electrical insulation and reliability.
Applications
It serves as the backbone for printed circuit boards (PCBs) in electronics and electrical equipment, providing excellent dimensional stability, heat resistance, and electrical insulation.
In the automotive sector, our FR-4 Copper Clad Laminate contributes to the production of reliable and high-performance PCBs for engine control units, infotainment systems, and advanced driver-assistance systems.
In the aerospace industry, it enables the creation of lightweight yet durable PCBs for avionics, communication systems, and flight control systems.
From consumer electronics such as smartphones, tablets, and laptops to industrial equipment, automotive components, and aerospace technology, FR-4 Copper Clad Laminate forms an integral part of countless electronic devices and systems.
Moreover, in the realm of renewable energy, our product supports the development of efficient and stable PCBs for solar panels, wind turbines, and energy storage systems.
Types Of Copper Clad Fr4
| TYPES | GRADES | CHARACTERISTICS |
|---|---|---|
| CCL FR-4 | Tufflam135 | 1. TG 130 ± 5C (DSC) 2. Process Type: Traditional FR-4 PCB processing. 3. Colour: Natural Color |
| TUFFLAM140 | TG 130 ± 5C (DSC) Process Type: Traditional FR-4 PCB processing. Property: UV blocking and A.O.1. property. |
|
| CCL FR-4 (Lead Free) | TUFFLAM140LF | TG ≥ 135C (DSC) Compatibility: Suitable for lead-free process Property: UV blocking and A.O.1 property Thermal Compatibility: Excellent thermal reliability Lower Z-axis CTE |
| TUFFLAM150 | TG 150C (DSC) Compatibility: Suitable for lead-free process Property: UV blocking and A.O.1 property Thermal Compatibility: Excellent thermal reliability Lower Z-axis CTE |
|
| CCL FR-4 (High CT) | TUFFLAM1600 | Resistance: Excellent tracking resistance CTI≥600 Property: UV blocking Processability: Good PCB processability |
Detailed Specs
| CHARACTERISTICS | CONDITIONING | UNIT | VALUES | SPECIFICATIONS |
|---|---|---|---|---|
| Glass Transition Temperature | DSC | C | 133 | 130±5 |
| Volume Resistivity | C-96/35/90 | MΩ-cm | 4.3 x 108 | ≥1.0 x 106 |
| Surface Resistivity | C-96/35/90 | MΩ | 5.1 x 107 | ≥1.0 x 104 |
| Permittivity (Rc40%) 1MHz | C-24/23/50 | - | 4.6 | ≤5.4 |
| Loss Tangent (RC40%) 1MHz | C-24/23/50 | - | 0.018 | ≤0.035 |
| Arc Resistance | D-48/50 +D -0.5/23 | Sec | 120 | ≥60 |
| Dielectric Breakdown | D-48/50 | KV | 60 | ≥40 |
| Water Absorption | D-24/23 | % | 0.1 | ≤0.8 |
| Flammability | C-24/23/50+E-24/125 | - | 94 V-0 | 94 V-0 |
| Peel Strength (1oz Cu. Foil) | A | N/mm | 1.88 | ≥1.05 |
| Thermal Stress | Solder dip | - | PASS | 10sec/288C |
| Flexural Strength LW | A | N/mm2 | 580 | ≥415 |
| CW | A | N/mm2 | 470 | ≥345 |
| Dimensional Stability X-Y Axis | E-2/150 | ppm | 200 | ≤300 |
| CTE before TG | TMA | ppm/C | 58 | - |
| Z-Axis after TG | TMA | ppm/C | 290 | - |
| 50-260C | TMA | % | 4.4 | - |
| T260 | TMA | Min | 13 | - |
| T288 | TMA | Min | 1 | - |
| CTI | IEC60112 | V | 200 | 175~250 (Grade 3) |
| THICKNESS | COPPER CLADDING | SIZE | SIZE | THICKNESS TOLERANCE |
|
|---|---|---|---|---|---|
| in mm | in Inch | OZ(μm) | in mm | in Inch | |
| 0.1 to 3.2 | 0.004 to 0.125 | 1/3(12) 0.5(17) | 1040 X 1240 & 2080 x 1240 |
41" X 49” & 82" x 49" | IPC-4101D Class C/M |
| 1.0(35) 2.0(70) | |||||
| 3.0(103) | |||||
TUFFLAM140: UV RESISTANT
| Characteristic | Conditioning | Unit | Typical Values | SPEC |
|---|---|---|---|---|
| Glass Transition Temperature | DSC | C | 140 | 130±5 |
| Volume Resistivity | C-96/35/90 | MΩ-cm | 4.9 x 108 | ≥1.0 x 106 |
| Surface Resistivity | C-96/35/90 | MΩ | 4.6 x 107 | ≥1.0 x 104 |
| Permittivity (Rc40%) 1MHz | C-24/23/50 | - | 4.5 | ≤5.4 |
| Loss Tangent (RC40%) 1MHz | C-24/23/50 | - | 0.016 | ≤0.035 |
| Arc Resistance | D-48/50 +D -0.5/23 | Sec | 120 | ≥60 |
| Dielectric Breakdown | D-48/50 | KV | 60 | ≥40 |
| Water Absorption | D-24/23 | % | 0.1 | ≤0.8 |
| Flammability | C-24/23/50+E-24/125 | - | 94 V-0 | 94 V-0 |
| Peel Strength (1oz Cu. Foil) | A | N/mm | 1.85 | ≥1.05 |
| Thermal Stress | Solder dip | - | PASS | 10sec/288C |
| Flexural Strength LW | A | N/mm2 | 550 | ≥415 |
| CW | A | N/mm2 | 480 | ≥345 |
| Dimensional Stability X-Y Axis | E-2/150 | ppm | 200 | ≤300 |
| CTE before TG | TMA | ppm/C | 55 | - |
| Z-axis after TG | TMA | ppm/C | 280 | - |
| 50-260C | TMA | % | 4.3 | - |
| T260 | TMA | Min | 15 | - |
| T288 | TMA | Min | 2 | - |
| CTI | IEC60112 | V | 200 | 175~250 (Grade 3) |
| THICKNESS | COPPER CLADDING | SIZE | SIZE | THICKNESS TOLERANCE |
|
|---|---|---|---|---|---|
| in mm | in Inch | OZ(μm) | in mm | in Inch | |
| 0.1 to 3.2 | 0.004 to 0.125 | 1/3(12) 0.5(17) | 1040 X 1240 & 2080 x 1240 |
41" X 49” & 82" x 49" | IPC-4101D Class C/M |
| 1.0(35) 2.0(70) | |||||
| 3.0(103) | |||||
TUFFLAM 150 MID TG & LOW CTE
| Characteristic | Conditioning | Unit | Typical Values | SPEC |
|---|---|---|---|---|
| Glass Transition Temperature | DSC | C | 155 | ≥150 |
| Volume Resistivity | C-96/35/90 | MΩ-cm | 4.3 x 108 | ≥1.0 x 106 |
| Surface Resistivity | C-96/35/90 | MΩ | 5.0 x 107 | ≥1.0 x 104 |
| Permittivity (Rc40%) 1MHz | C-24/23/50 | - | 4.6 | ≤5.4 |
| Loss Tangent (RC40%) 1MHz | C-24/23/50 | - | 0.016 | ≤0.035 |
| Arc Resistance | D-48/50 +D -0.5/23 | Sec | 120 | ≥60 |
| Dielectric Breakdown | D-48/50 | KV | 60 | ≥40 |
| Water Absorption | D-24/23 | % | 0.1 | ≤0.8 |
| Flammability | C-24/23/50+E-24/125 | - | 94 V-0 | 94 V-0 |
| Peel Strength (1oz Cu. Foil) | A | N/mm | 1.75 | ≥1.05 |
| Thermal Stress | Solder dip | - | PASS | 10sec/288C |
| Flexural Strength LW | A | N/mm2 | 550 | ≥415 |
| CW | A | N/mm2 | 450 | ≥345 |
| Dimensional Stability X-Y Axis | E-2/150 | ppm | 200 | ≤300 |
| CTE before TG | TMA | ppm/C | 50 | ≤60 |
| Z-axis after TG | TMA | ppm/C | 245 | ≤300 |
| 50-260C | TMA | % | 3 | ≤3.5 |
| TD | TGA (5%WtLoss,10C/Min) | C | 340 | ≥325 |
| T260 | TMA | Min | 50 | ≥30 |
| T288 | TMA | Min | 10 | ≥5 |
| CTI | IEC60112 | V | 200 | 175~250 (Grade 3) |
| THICKNESS | COPPER CLADDING | SIZE | SIZE | THICKNESS TOLERANCE |
|
|---|---|---|---|---|---|
| in mm | in Inch | OZ(μm) | in mm | in Inch | |
| 0.1 to 3.2 | 0.004 to 0.125 | 1/3(12) 0.5(17) | 1040 X 1240 & 2080 x 1240 |
41" X 49” & 82" x 49" | IPC-4101D Class C/M |
| 1.0(35) 2.0(70) | |||||
| 3.0(103) | |||||
TUFFLAM 1600: HIGH CTI
| Characteristic | Conditioning | Unit | Typical Values | SPEC |
|---|---|---|---|---|
| Glass Transition Temperature | DSC | C | 155 | 130±5 |
| Volume Resistivity | C-96/35/90 | MΩ-cm | 3.6 x 108 | ≥1.0 x 106 |
| Surface Resistivity | C-96/35/90 | MΩ | 4.5 x 107 | ≥1.0 x 104 |
| Permittivity (Rc40%) 1MHz | C-24/23/50 | - | 4.6 | ≤5.4 |
| Loss Tangent (RC40%) 1MHz | C-24/23/50 | - | 0.016 | ≤0.035 |
| Arc Resistance | D-48/50 +D -0.5/23 | Sec | 120 | ≥60 |
| Dielectric Breakdown | D-48/50 | KV | 60 | ≥40 |
| Water Absorption | D-24/23 | % | 0.1 | ≤0.8 |
| Flammability | C-24/23/50+E-24/125 | - | 94 V-0 | 94 V-0 |
| Peel Strength (1oz Cu. Foil) | A | N/mm | 1.65 | ≥1.05 |
| Thermal Stress | Solder dip | - | PASS | 10sec/288C |
| Flexural Strength LW | A | N/mm2 | 530 | ≥415 |
| CW | A | N/mm2 | 460 | ≥345 |
| CTI | IEC60112 | V | 600 | ≥600(Grade 0) |
| THICKNESS | COPPER CLADDING | SIZE | SIZE | THICKNESS TOLERANCE |
|
|---|---|---|---|---|---|
| in mm | in Inch | OZ(μm) | in mm | in Inch | |
| 0.1 to 3.2 | 0.004 to 0.125 | 1/3(12) 0.5(17) | 1040 X 1240 & 2080 x 1240 |
41" X 49” & 82" x 49" | IPC-4101D Class C/M |
| 1.0(35) 2.0(70) | |||||
| 3.0(103) | |||||
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